The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Nov. 09, 2018
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/3121 (2013.01); H01L 23/49894 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/16 (2013.01); H05K 1/02 (2013.01); H01L 2224/18 (2013.01);
Abstract
Disclosed herein is a multilayer circuit board that includes a plurality of conductor layers laminated with insulating layers interposed therebetween. The plurality of conductor layers include a first conductor layer, a second conductor layer, and a first shield layer disposed between the first and second conductor layers. The first shield layer is smaller in conductor thickness than the first and second conductor layers and is connected to none of the plurality of conductor layers within its surface.