Systems and methods for sheathing electronic components

Abstract

Illustrative systems and methods disclosed herein pertain to a circuit assembly having components mounted upon a substratum element. The components are encased in a conductive sheath that may be made of metal. The conductive sheath, which is operative as a heat sink and/or an EMI shield, is structurally constructed to counteract deformation of the substratum element when the one or more components heat up during operation, or due to ambient temperature changes. In one exemplary embodiment, the conductive sheath has different thickness at different locations. An edge portion located at a transition between a first thickness and a second thickness of the conductive sheath undergoes deformation that prevents warping of the circuit assembly due to heat. In another exemplary embodiment, the conductive sheath has a gap provided between adjacent segments. The gap allows room for thermal expansion and counteracts deformation of the circuit assembly caused by heating.