The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Feb. 07, 2017
Applicant:
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Inventors:
Shinnosuke Soda, Chiyoda-ku, JP;
Hiroshi Kobayashi, Chiyoda-ku, JP;
Assignee:
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 23/48 (2013.01); H01L 23/495 (2013.01); H01L 24/33 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 2224/33 (2013.01); H01L 2224/40225 (2013.01); H01L 2924/181 (2013.01);
Abstract
A power module includes a first power semiconductor device including a first electrode, a resin frame including first receiving portions, and a first leadframe. The first leadframe has a first main surface facing the first electrode and is electrically and mechanically connected to the first electrode. The first receiving portions face the first main surface of the first leadframe and receive part of the first leadframe. Thus, the power module has high reliability and can be miniaturized.