The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Jun. 25, 2019
Murata Manufacturing Co., Ltd., Kyoto, JP;
Katsuhiko Fujikawa, Kyoto, JP;
Shingo Funakawa, Kyoto, JP;
Kazushige Sato, Kyoto, JP;
Nobumitsu Amachi, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A circuit module () includes a first substrate (), a first module (), a sealing resin portion (), and a conductive material film (). The first substrate () has a first principal surface (). The first module () is mounted on the first principal surface (). The sealing resin portion () is formed on the first principal surface () and covers the first module (). The conductive material film () covers a side of the sealing resin portion (). The first module () includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film () on the side of the sealing resin portion ().