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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10741465 B1

PDFFull Text
Date of Patent:
Aug. 11, 2020

Filed:

Jun. 25, 2019

Circuit module and method of manufacturing the same

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Katsuhiko Fujikawa, Kyoto, JP;

Shingo Funakawa, Kyoto, JP;

Kazushige Sato, Kyoto, JP;

Nobumitsu Amachi, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Selim U Ahmed

Assistant Examiner:

Evan G Clinton

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/36 (2006.01); H01L 23/495 (2006.01); H01L 25/065 (2006.01); H05K 3/36 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/31 (2013.01); H01L 23/29 (2013.01); H01L 23/36 (2013.01); H01L 23/3736 (2013.01); H01L 23/4334 (2013.01); H01L 23/495 (2013.01); H01L 23/49568 (2013.01); H01L 25/0652 (2013.01); H05K 3/36 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10621 (2013.01); H05K 2201/2018 (2013.01);
Abstract

A circuit module () includes a first substrate (), a first module (), a sealing resin portion (), and a conductive material film (). The first substrate () has a first principal surface (). The first module () is mounted on the first principal surface (). The sealing resin portion () is formed on the first principal surface () and covers the first module (). The conductive material film () covers a side of the sealing resin portion (). The first module () includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film () on the side of the sealing resin portion ().

Find Patent Forward Citations

Fujikawa, Katsuhiko. (2020). Circuit module and method of manufacturing the same (U.S. Patent No. 10741465). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10741465

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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