logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10741464 B1

PDFFull Text
Date of Patent:
Aug. 11, 2020

Filed:

Jun. 22, 2017

Active ester resin and cured product thereof

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Yutaka Satou, Ichihara, JP;

Tatsuya Okamoto, Ichihara, JP;

Akito Kawasaki, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:

Locke Lord LLP

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08G 59/42 (2006.01); C08G 59/02 (2006.01); H05K 1/03 (2006.01); C08G 63/133 (2006.01); C08L 63/00 (2006.01); C08L 67/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08G 59/02 (2013.01); C08G 59/4223 (2013.01); C08G 63/133 (2013.01); C08L 63/00 (2013.01); C08L 67/02 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H05K 1/03 (2013.01); C08L 2203/206 (2013.01);
Abstract

Provided are an active ester resin capable of having low cure shrinkage and forming a cured product having a low dielectric loss tangent, a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material. The active ester resin includes a product of reaction of essential raw materials including: a phenolic hydroxyl group-containing compound (A); a polynaphthol resin (B) having a molecular structure in which naphthol compound (b) moieties are linked with an aromatic ring- or cyclo ring-containing structural moiety (α); and an aromatic polycarboxylic acid or an acid halide thereof (C). Also provided are a curable resin composition including the ester resin, a cured product of the resin composition, a printed wiring board, and a semiconductor encapsulating material.

Find Patent Forward Citations

Satou, Yutaka. (2020). Active ester resin and cured product thereof (U.S. Patent No. 10741464). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10741464

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…