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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10741463 B1

PDFFull Text
Date of Patent:
Aug. 11, 2020

Filed:

Jun. 01, 2018

Shielded module

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Shigeru Endo, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/28 (2006.01); H01L 23/04 (2006.01); H01P 3/08 (2006.01); H05K 9/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/28 (2013.01); H01L 23/04 (2013.01); H01L 23/552 (2013.01); H01P 3/08 (2013.01); H05K 9/0009 (2013.01); H05K 9/0015 (2013.01); H05K 9/0073 (2013.01); H01L 23/3107 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A moduleincludes a multilayer wiring board, a componentthat is mounted on a main surfaceof the multilayer wiring board, a sealing-resin layerthat is laminated on the main surfaceof the multilayer wiring board, and a resin coating layerthat coats a surface of the sealing-resin layer. The resin coating layerincludes a shield filmand outer electrodes, and opposite surfacesof the outer electrodesand an opposite surfaceof the shield filmare formed on the same plane. The modulecan be connected to, for example, an external antenna without using a wiring electrode of a mother substrate, and thus, signal loss can be suppressed.

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Endo, Shigeru. (2020). Shielded module (U.S. Patent No. 10741463). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10741463

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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