The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Sep. 28, 2018
International Business Machines Corporation, Armonk, NY (US);
Baozhen Li, South Burlington, VT (US);
Chih-Chao Yang, Glenmont, NY (US);
Andrew Tae Kim, Poughkeepsie, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A via and a method of fabricating a via in an integrated circuit involve forming a trench in dielectric material deposited above a first cap of a first metal level. The method includes patterning a collar from insulator material directly above the first cap, and etching through the first cap, within an area surrounded by the collar, to a first metal layer of the first metal level directly below the first cap. A liner is conformally deposited. The liner lines sidewalls of the collar. A metal conductor is deposited to form the via and a second metal layer of a second metal level.