The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Jun. 05, 2018
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Yezdi N. Dordi, Palo Alto, CA (US);

Aniruddha Joi, San Jose, CA (US);

Steven James Madsen, Mountain View, CA (US);

Dries Dictus, Villach, AT;

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 21/67 (2006.01); H01L 21/762 (2006.01); H01L 21/321 (2006.01); C25D 3/12 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76832 (2013.01); H01L 21/28556 (2013.01); H01L 21/3212 (2013.01); H01L 21/6723 (2013.01); H01L 21/762 (2013.01); H01L 21/76864 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); H01L 21/76873 (2013.01);
Abstract

A method comprises depositing a barrier layer on a dielectric layer to prevent oxidation of a metal layer to be deposited by electroplating due to an oxide present in the dielectric layer and depositing a doped liner layer on the barrier layer to bond with the metal layer to be deposited on the liner layer by the electroplating. The dopant forms a protective passivation layer on a surface of the liner layer and dissolves during the electroplating so that the metal layer deposited on the liner layer by the electroplating bonds with the liner layer. The dopant reacts with the dielectric layer and forms a layer of a compound between the barrier layer and the dielectric layer. The compound layer prevents oxidation of the barrier layer and the liner layer due to the oxide present in the dielectric layer and adheres the barrier layer to the dielectric layer.


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