The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Jan. 27, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Aaron Muir Hunter, Santa Cruz, CA (US);

Mehran Behdjat, San Jose, CA (US);

Niraj Merchant, San Francisco, CA (US);

Douglas R. McAllister, Pleasanton, CA (US);

Dongming Iu, Union City, CA (US);

Kong Lung Chan, Newark, CA (US);

Lara Hawrylchak, Gilroy, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); C23C 16/458 (2006.01); C23C 16/455 (2006.01); C23C 16/452 (2006.01); C23C 16/44 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); C23C 16/4586 (2013.01); C23C 16/45561 (2013.01); H01L 21/67017 (2013.01); H01L 21/6719 (2013.01); C23C 16/4404 (2013.01); C23C 16/4412 (2013.01); C23C 16/452 (2013.01); C23C 16/45565 (2013.01); H01J 37/3244 (2013.01); H01J 37/32477 (2013.01); H01J 37/32899 (2013.01);
Abstract

A semiconductor processing apparatus is described that has a body with a wall defining two processing chambers within the body; a passage through the wall forming a fluid coupling between the two processing chambers; a lid removably coupled to the body, the lid having a portal in fluid communication with the passage; a gas activator coupled to the lid outside the processing chambers, the gas activator having an outlet in fluid communication with the portal of the lid; a substrate support disposed in each processing chamber, each substrate support having at least two heating zones, each with an embedded heating element; a gas distributor coupled to the lid facing each substrate support; and a thermal control member coupled to the lid at an edge of each gas distributor.


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