The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Sep. 28, 2018
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Kazuhide Sumiyoshi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/455 (2006.01); C23C 16/34 (2006.01); H01L 29/778 (2006.01); H01L 29/66 (2006.01); H01L 29/417 (2006.01); H01L 29/20 (2006.01); H01L 23/29 (2006.01); H01L 21/027 (2006.01); H01L 23/31 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0217 (2013.01); C23C 16/345 (2013.01); C23C 16/45557 (2013.01); H01L 21/02211 (2013.01); H01L 21/02271 (2013.01); H01L 23/291 (2013.01); H01L 29/2003 (2013.01); H01L 29/41766 (2013.01); H01L 29/66462 (2013.01); H01L 29/7787 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/0274 (2013.01); H01L 21/02378 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 23/3171 (2013.01);
Abstract

A process of depositing a silicon nitride (SiN) film on a nitride semiconductor layer is disclosed. The process includes steps of: (a) loading an epitaxial substrate including the nitride semiconductor layer into a reaction furnace at a first temperature and converting an atmosphere in the furnace into nitrogen (N); (b) raising the temperature in the furnace to a second temperature while keeping pressure in the furnace at a first pressure higher than 30 kPa; (c) converting the atmosphere in the furnace to ammonia (NH) at the second temperature; and (d) beginning the deposition by supplying SiHClas a source gas for silicon (Si) at a second pressure lower than 100 Pa. A feature of the process is that a time span from when the temperature in the furnace reaches the critical temperature to the supply of SiHClis shorter than 20 minutes, where the first pressure becomes the equilibrium pressure at the critical temperature.


Find Patent Forward Citations

Loading…