The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Oct. 12, 2017
Applicant:

Avx Corporation, Fountain Inn, SC (US);

Inventors:

Issei Nakata, Takashima, JP;

Jan Petrzilek, Usti nad Orlici, CZ;

Miloslav Uher, Lanskroun, CZ;

Tomas Hofirek, Rozna, CZ;

Assignee:

AVX Corporation, Fountain Inn, SC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/15 (2006.01); H01G 9/08 (2006.01); H01G 9/07 (2006.01); H01G 9/052 (2006.01); H01G 9/042 (2006.01); H01G 9/028 (2006.01); H01G 9/012 (2006.01); H01G 9/00 (2006.01); C08G 61/12 (2006.01); H01G 9/26 (2006.01);
U.S. Cl.
CPC ...
H01G 9/15 (2013.01); C08G 61/126 (2013.01); H01G 9/0036 (2013.01); H01G 9/012 (2013.01); H01G 9/028 (2013.01); H01G 9/042 (2013.01); H01G 9/07 (2013.01); H01G 9/08 (2013.01); H01G 9/26 (2013.01); C08G 2261/1424 (2013.01); C08G 2261/3223 (2013.01); C08G 2261/43 (2013.01); C08G 2261/512 (2013.01); C08G 2261/516 (2013.01); H01G 9/052 (2013.01);
Abstract

A capacitor assembly that is capable of exhibiting good electrical properties even under a variety of conditions is provided. More particularly, the capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric. The solid electrolyte contains an adhesion layer that is positioned between an inner conductive polymer layer and an outer conductive polymer layer. The adhesion layer is formed from an organometallic compound and the outer layer is formed from pre-polymerized conductive polymer particles.


Find Patent Forward Citations

Loading…