The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Nov. 22, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Hae Jin Lee, Seoul, KR;
Kyung Ha Koo, Seoul, KR;
Jung Je Bang, Suwon-si, KR;
Chi Hyun Cho, Yongin-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01); H01L 23/427 (2006.01); G11B 33/14 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); G11B 33/1406 (2013.01); H01L 23/427 (2013.01); H05K 7/20336 (2013.01); H05K 9/0032 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/19105 (2013.01);
Abstract
An electronic device according to an embodiment of the present disclosure includes a printed circuit board (PCB), a first component disposed in a first region on the PCB and a second component disposed in a second region on the PCB, and a chamber disposed on the first and second components and having a region including the first and second regions, in which fluid absorbing heat radiating from the first and second components is included in the chamber.