The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Apr. 30, 2019
Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Ming Zhang, Fremont, CA (US);

Yin Qian, Milpitas, CA (US);

Libo Weng, San Jose, CA (US);

Dyson H. Tai, San Jose, CA (US);

Chia-Ying Liu, Hsinchu, TW;

Chia-Jung Liu, Hsinchu, TW;

Assignee:

OmniVision Technologies, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1337 (2006.01); G02F 1/1335 (2006.01); G02F 1/1362 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13378 (2013.01); G02F 1/133553 (2013.01); G02F 1/136277 (2013.01); G02F 2202/105 (2013.01);
Abstract

A reflective semiconductor device includes integrated circuitry disposed in a semiconductor layer. A first plurality of mirrors is formed in a mirror layer over the semiconductor layer, and each of the first plurality of mirrors is spaced apart from one another by at least a uniform width. A thin dielectric film layer covers sidewalls of the first plurality of mirrors and the semiconductor layer in the regions between the spaced apart first plurality of mirrors. A second plurality of mirrors are formed in the mirror layer between the thin dielectric film layer covered sidewalls of the first plurality of mirrors and over the thin dielectric film layer covering the semiconductor layer. Each one of the first and second plurality of mirrors has the uniform width, and is coupled to the integrated circuitry disposed in the semiconductor layer.


Find Patent Forward Citations

Loading…