The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10738389 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 11, 2020

Filed:

Sep. 08, 2015
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Takashi Izumi, Yokkaichi, JP;

Fumitoshi Ikegaya, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/12 (2006.01); C25D 3/38 (2006.01); C25D 21/14 (2006.01); C25D 21/18 (2006.01); C25D 21/12 (2006.01); H05K 3/42 (2006.01); C25D 21/16 (2006.01);
U.S. Cl.
CPC ...
C25D 7/123 (2013.01); C25D 3/38 (2013.01); C25D 21/12 (2013.01); C25D 21/14 (2013.01); C25D 21/16 (2013.01); C25D 21/18 (2013.01); H05K 3/424 (2013.01);
Abstract

A semiconductor manufacturing apparatus according to an embodiment comprises a container contains a mixed solution that includes a processing solution for plating processing of a substrate and an additive and being capable of draining a part of the mixed solution when a first condition is satisfied. A first supplier supplies the processing solution to the container. A second supplier supplies the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished.


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Izumi, Takashi. (2020). Semiconductor manufacturing apparatus (U.S. Patent No. 10738389). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10738389

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