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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10738376 B1

PDFFull Text
Date of Patent:
Aug. 11, 2020

Filed:

Aug. 29, 2016

Hard coating for cutting tool

Applicant:

Korloy Inc., Seoul, KR;

Inventors:

Je-Hun Park, Cheongju-si, KR;

Beom-Sik Kim, Cheongju-si, KR;

Seung-Su Ahn, Cheongju-si, KR;

Kyoung-il Kim, Cheongju-si, KR;

Dong-Youl Lee, Cheongju-si, KR;

Sun-Yong Ahn, Cheongju-si, KR;

Young-Heum Kim, Cheongju-si, KR;

Assignee:

KORLOY INC., Seoul, KR;

Attorney:

Revolution IP, PLLC

Primary Examiner:

Archene A Turner

Int. Cl.
CPC ...
C23C 14/06 (2006.01); C23C 28/00 (2006.01); C23C 28/04 (2006.01); C23C 28/02 (2006.01); C23C 14/32 (2006.01); C23C 14/16 (2006.01); C23C 14/18 (2006.01); C23C 14/54 (2006.01); B23B 27/14 (2006.01); B23C 5/16 (2006.01);
U.S. Cl.
CPC ...
C23C 14/0641 (2013.01); C23C 14/16 (2013.01); C23C 14/18 (2013.01); C23C 14/325 (2013.01); C23C 14/548 (2013.01); C23C 28/00 (2013.01); C23C 28/02 (2013.01); C23C 28/04 (2013.01); B23B 27/14 (2013.01); B23B 2228/105 (2013.01); B23C 5/16 (2013.01); B23C 2228/10 (2013.01);
Abstract

A hard coating includes a thin film layer which has a total thickness of 0.5-10 μm and has an overall composition of AlTiMeN (0.2<a≤0.6, 0<b≤0.15), where Me is a nitride constituent element having a thermal expansion coefficient of greater than 2.7×10/° C. and less than 9.35×10/° C., wherein the thin film layer has a structure in which a nano-multilayered-structure of thin layers A, B and C, thin layer B being disposed between thin layer A and thin layer C, is repeatedly laminated at least once.

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