The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Jun. 06, 2017
Applicant:

Sabic Global Technologies B.v., Bergen op Zoom, NL;

Inventors:

Mingcheng Guo, Shanghai, CN;

Yaqin Zhang, Shanghai, CN;

Shijie Song, Shanghai, CN;

Narong An, Shanghai, CN;

Yubin Bao, Shanghai, CN;

Assignee:

SABIC Global Technologies B.V., Bergen op Zoom, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); B29C 48/00 (2019.01); B29C 45/00 (2006.01); C08L 69/00 (2006.01); B29K 69/00 (2006.01); B29K 509/08 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B29C 45/0001 (2013.01); B29C 48/022 (2019.02); C08L 69/00 (2013.01); B29K 2069/00 (2013.01); B29K 2509/08 (2013.01); B29K 2995/0013 (2013.01); B29K 2995/0089 (2013.01); C08K 2201/001 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

Thermally conductive compositions include from about 20 wt. % to about 80 wt. % of a polycarbonate polymer, from about 0.5 wt. % to about 30 wt. % of an impact modifier, and a thermal conductivity modifier. The thermal conductivity modifier includes from about 0.5 wt. % to about 10 wt. % of a high density polyethylene polymer, from about 0.5 wt. % to about 10 wt. % of a maleic anhydride type copolymer, or from about 0.01 wt. % to about 10 wt. % of an acid component. In some aspects the thermally conductive compositions have a notched Izod impact strength of at least about 30 J/m, a through-plane thermal conductivity of at least about 0.4 W/mK and/or an in-plane thermal conductivity of at least about 1.0 W/mK. Methods for making the compositions and articles formed according to the methods are also described.


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