The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Jan. 12, 2017
Sika Technology Ag, Baar, CH;
Michael Gutgsell, Uster, CH;
John Hanley, IV, Sterling Heights, MI (US);
SIKA TECHNOLOGY AG, Baar, CH;
Abstract
A one-component heat-curing epoxy resin adhesive has at least one epoxy resin having an average of more than one epoxy group per molecule; at least one latent hardener for epoxy resins; and at least one carboxylic acid selected from substituted or unsubstituted adipic acid, substituted or unsubstituted succinic acid, substituted or unsubstituted phthalic acid, substituted or unsubstituted terephthalic acid, substituted or unsubstituted isophthalic acid, substituted or unsubstituted benzenetricarboxylic acid and substituted or unsubstituted nitrobenzoic acid, excluding 2-hydroxysuccinic acid and 2,3-dihydroxysuccinic acid as carboxylic acid, and wherein the epoxy resin adhesive contains 0.0015 to 0.04 mol of the at least one carboxylic acid per 100 g of the epoxy resin adhesive and the epoxy resin adhesive has a viscosity of 500-5000 Pas at 25° C. The epoxy resin adhesive is notable for a very heat-resistant bond on particular metal substrates such as steel having a zinc-magnesium coating.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile