The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Dec. 19, 2017
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Hyunjeong Jeon, Seoul, KR;

Sang Soo Jee, Hwaseong-si, KR;

Kyeong-sik Ju, Suwon-si, KR;

Assignees:

SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;

SAMSUN SDI CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/14 (2006.01); C09D 179/08 (2006.01); C08J 5/18 (2006.01); C08G 73/10 (2006.01); C08G 18/60 (2006.01); C08G 18/76 (2006.01); C08G 18/73 (2006.01); C08G 18/64 (2006.01); C08G 18/75 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
C08G 73/14 (2013.01); C08G 18/603 (2013.01); C08G 18/6438 (2013.01); C08G 18/73 (2013.01); C08G 18/755 (2013.01); C08G 18/7621 (2013.01); C08G 73/1035 (2013.01); C08J 5/18 (2013.01); C09D 179/08 (2013.01); G02F 1/133308 (2013.01); C08G 2150/00 (2013.01); C08J 2379/08 (2013.01); G02F 1/133305 (2013.01); G02F 2001/133331 (2013.01);
Abstract

A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.


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