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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10737965 B1

PDFFull Text
Date of Patent:
Aug. 11, 2020

Filed:

Jul. 05, 2017

Method of manufacturing glass sheet

Applicant:

Nippon Electric Glass Co., Ltd., Shiga, JP;

Inventors:

Hiroki Katayama, Shiga, JP;

Hiroshi Nakajima, Shiga, JP;

Assignee:

NIPPON ELECTRIC GLASS CO., LTD., Shiga, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Erin Snelting

Int. Cl.
CPC ...
C03B 29/02 (2006.01); C03B 17/06 (2006.01); C03B 33/00 (2006.01); C03C 19/00 (2006.01); H01L 23/00 (2006.01); C03C 3/087 (2006.01); C03C 3/093 (2006.01); C03C 3/091 (2006.01); C03C 23/00 (2006.01); C03B 33/09 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
C03B 29/02 (2013.01); C03B 17/064 (2013.01); C03B 29/025 (2013.01); C03B 33/091 (2013.01); C03C 3/087 (2013.01); C03C 3/091 (2013.01); C03C 3/093 (2013.01); C03C 19/00 (2013.01); C03C 23/0025 (2013.01); H01L 21/6835 (2013.01); H01L 24/00 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 24/11 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A technical object of the present invention is to devise a glass sheet that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and has high end surface strength, and a method of manufacturing the glass sheet, to thereby contribute to an increase in density of a semiconductor package. The glass sheet of the present invention has a total thickness variation of less than 2.0 μm, all or part of an end surface of the glass sheet including a melt-solidified surface.

Find Patent Forward Citations

Katayama, Hiroki. (2020). Method of manufacturing glass sheet (U.S. Patent No. 10737965). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10737965

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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