The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Mar. 28, 2017
Applicant:

University of Florida Research Foundation, Incorporated, Gainesville, FL (US);

Inventors:

Tiffany N. Reagan, Gainesville, FL (US);

Mark Sheplak, Gainesville, FL (US);

Dylan P. Alexander, Gainesville, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H04R 19/04 (2006.01); H04R 3/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); H04R 19/00 (2006.01); H04R 17/02 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81B 7/0006 (2013.01); B81B 7/02 (2013.01); B81C 1/00301 (2013.01); H04R 3/005 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/096 (2013.01); H04R 17/02 (2013.01); H04R 19/005 (2013.01); H04R 2201/003 (2013.01); H04R 2499/13 (2013.01);
Abstract

Flush mount sensor packages and packaging methods for micromachined transducers, which can be used for fluid flow measurements, are provided. A sensor package can include a substrate, a sensor mounted on a front side of the substrate, a wire bond coupled to the sensor and passing through the substrate, and a shim cap positioned around the sensor. The wire bond does not protrude above the topside of the sensor, and the shim cap and the sensor can be substantially flush.


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