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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10737477 B1

PDFFull Text
Date of Patent:
Aug. 11, 2020

Filed:

Sep. 11, 2017

Bonding device and method for producing plate-shaped bonded assembly

Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Hiroyuki Usui, Tochigi, JP;

Yoshihisa Shinya, Tochigi, JP;

Yasumi Endo, Tochigi, JP;

Assignee:

Dexerials Corporation, Tokyo, JP;

Attorney:

Osha Liang LLP

Primary Examiner:

Michael N Orlando

Assistant Examiner:

Elizabeth Bradford

Int. Cl.
CPC ...
B32B 37/12 (2006.01); H01J 37/32 (2006.01); B29C 65/14 (2006.01); B29C 65/48 (2006.01); B29C 65/52 (2006.01); B29C 65/00 (2006.01); G02F 1/13 (2006.01); B29C 65/78 (2006.01); B29L 31/34 (2006.01); G02F 1/1333 (2006.01); G02F 1/1341 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1284 (2013.01); B29C 65/1435 (2013.01); B29C 65/1448 (2013.01); B29C 65/1483 (2013.01); B29C 65/4845 (2013.01); B29C 65/524 (2013.01); B29C 66/1122 (2013.01); B29C 66/324 (2013.01); B29C 66/342 (2013.01); B29C 66/343 (2013.01); B29C 66/3452 (2013.01); B29C 66/45 (2013.01); B29C 66/73366 (2013.01); B29C 66/7465 (2013.01); B29C 66/81267 (2013.01); B29C 66/8322 (2013.01); G02F 1/1303 (2013.01); H01J 37/32321 (2013.01); B29C 65/1454 (2013.01); B29C 65/1464 (2013.01); B29C 65/7847 (2013.01); B29L 2031/3475 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/202 (2013.01); G02F 1/1341 (2013.01); G02F 2001/133331 (2013.01);
Abstract

A method for producing a bonded plate-shaped assembly includes retaining a pair of plate-shaped members facing each other by a pair of retaining base members; charging a photo-curable liquid material between the pair of plate-shaped members facing each other; causing movement of the pair of retaining base members by a retaining base member movement unit to cause the pair of plate-shaped members to draw close to each other to cause wetting spreading of the liquid material between the pair of plate-shaped members; detecting a wetting spreading state of the liquid material by a sensor; and illuminating curing light, in response to the result of detection, to the liquid material wettingly spread to the entire surfaces of the pair of plate-shaped members, to form the bonded plate-shaped assembly made up of the pair of plate-shaped members bonded together.

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