The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Feb. 08, 2019
Applicant:
Warsaw Orthopedic, Inc., Warsaw, IN (US);
Inventors:
Benjamin T. Reves, Germantown, TN (US);
David S. Scher, Collierville, TN (US);
Roger E. Harrington, Collierville, TN (US);
Jerbrena C. Jacobs, Hernando, MS (US);
Assignee:
Warsaw Orthopedic, Inc., Warsaw, IN (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61L 27/54 (2006.01); A61L 27/24 (2006.01); A61L 27/58 (2006.01); A61L 27/10 (2006.01); A61L 27/44 (2006.01); A61L 27/46 (2006.01); A61K 31/575 (2006.01); A61K 38/17 (2006.01); A61K 38/18 (2006.01); A61L 27/26 (2006.01); A61L 27/42 (2006.01);
U.S. Cl.
CPC ...
A61L 27/54 (2013.01); A61K 31/575 (2013.01); A61K 38/1709 (2013.01); A61K 38/1875 (2013.01); A61L 27/10 (2013.01); A61L 27/24 (2013.01); A61L 27/26 (2013.01); A61L 27/425 (2013.01); A61L 27/446 (2013.01); A61L 27/46 (2013.01); A61L 27/58 (2013.01); A61F 2210/0076 (2013.01); A61F 2230/0069 (2013.01); A61L 2300/222 (2013.01); A61L 2300/412 (2013.01); A61L 2300/414 (2013.01); A61L 2300/45 (2013.01); A61L 2300/604 (2013.01); A61L 2430/02 (2013.01);
Abstract
Provided is a compression resistant implant configured to fit at or near a bone defect to promote bone growth. The compression resistant implant comprises a biodegradable polymer in an amount of about 0.1 wt % to about 20 wt % of the implant and a freeze-dried oxysterol in an amount of about 5 wt % to about 90 wt % of the implant. Methods of making and use are further provided.