The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Oct. 16, 2014
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Ronald Dekker, Eindhoven, NL;

Vincent Adrianus Henneken, Eindhoven, NL;

Angel Metodiev Savov, Eindhoven, NL;

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/14 (2006.01); A61B 8/00 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); A61B 8/12 (2006.01); H01L 25/04 (2014.01);
U.S. Cl.
CPC ...
A61B 8/4494 (2013.01); A61B 8/12 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/94 (2013.01); H01L 25/042 (2013.01); A61B 2562/0204 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/94 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01);
Abstract

An integrated circuit array, in particular for two dimensional sensor arrays such as ultrasound imaging systems is disclosed. The integrated circuit array () comprises a plurality of integrated circuit elements () each formed in a substrate (), wherein the substrates are separated from each other. The array comprises a flexible and/or stretchable connection layer () connected to the integrated circuit elements for flexibly connecting the integrated circuit elements to each other. The array further comprises a plurality of electrical interconnects () for electrically connecting the integrated circuit elements to each other, wherein the electrical interconnects are formed as metal lines in one piece with integrated interconnects of the integrated circuit elements.


Find Patent Forward Citations

Loading…