The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Dec. 06, 2018
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Gokul Murugesan, Karnataka, IN;

Santosh Kustagi, Karnataka, IN;

Raghuveer Hanumanthrao Desai, Karnataka, IN;

V Valiveti, Andhra Pradesh, IN;

Assignee:

HONEYWELL INTERNATIONAL INC., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 5/00 (2006.01); H05K 5/03 (2006.01); H05K 7/20 (2006.01); G06F 30/23 (2020.01); G06F 30/39 (2020.01); G06F 111/20 (2020.01);
U.S. Cl.
CPC ...
H05K 9/0049 (2013.01); G06F 30/23 (2020.01); G06F 30/39 (2020.01); H05K 5/006 (2013.01); H05K 5/0056 (2013.01); H05K 5/03 (2013.01); H05K 7/20436 (2013.01); G06F 2111/20 (2020.01);
Abstract

A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.


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