The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Jan. 31, 2019
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Kazunori Uchiyama, Okazaki, JP;

Naoki Hakamada, Anjo, JP;

Tomo Sasaki, Toyota, JP;

Masataka Deguchi, Nagoya, JP;

Koji Hotta, Miyoshi, JP;

Tadafumi Yoshida, Kasugai, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2049 (2013.01); H01L 23/367 (2013.01); H01L 23/40 (2013.01); H01L 23/4012 (2013.01); H01L 23/473 (2013.01); H05K 7/20927 (2013.01); H01L 23/3735 (2013.01);
Abstract

A semiconductor device may include a stack in which a cooler and a semiconductor module are stacked, the semiconductor module housing a semiconductor element; a contact plate contacting the stack in a stacking direction of the semiconductor module and the cooler; and a spring contacting the contact plate and pressurizing the stack via the contact plate in the stacking direction, wherein the spring may contact a center portion of the contact plate in a direction perpendicular to the stacking direction, and a recess or a cavity may be provided at the center portion of the contact plate, the recess facing the stack.


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