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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10736235 B1

PDFFull Text
Date of Patent:
Aug. 04, 2020

Filed:

Sep. 13, 2018

Cooling mechanism of high mounting flexibility

Applicant:

Adlink Technology Inc., New Taipei, TW;

Inventors:

Hsiu-Ling Yu, New Taipei, TW;

Hsuan-Chan Chiang, New Taipei, TW;

Assignee:

ADLINK TECHNOLOGY INC., New Taipei, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Jon T Schermerhorn, Jr

Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 15/02 (2006.01); H01L 23/40 (2006.01); H05K 1/02 (2006.01); F28F 9/26 (2006.01); F28F 3/12 (2006.01); F28F 1/02 (2006.01); G06F 1/20 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/0233 (2013.01); F28D 15/0275 (2013.01); F28F 1/02 (2013.01); F28F 3/12 (2013.01); F28F 9/266 (2013.01); G06F 1/20 (2013.01); H01L 23/40 (2013.01); H01L 23/427 (2013.01); H05K 1/0203 (2013.01); H05K 7/20436 (2013.01); H05K 7/20809 (2013.01); F28F 2255/02 (2013.01); F28F 2275/08 (2013.01); F28F 2275/14 (2013.01); F28F 2275/20 (2013.01); F28F 2280/00 (2013.01);
Abstract

A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

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