The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Sep. 07, 2017
Applicant:
Ares Materials, Inc., Dallas, TX (US);
Inventors:
Radu Reit, Carrollton, TX (US);
David Arreaga-Salas, Garland, TX (US);
Assignee:
ARES MATERIALS INC., Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H01L 51/00 (2006.01); H05K 1/18 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); H05K 1/0393 (2013.01); H05K 3/0014 (2013.01); H05K 3/0055 (2013.01); H01L 27/1218 (2013.01); H01L 51/0097 (2013.01); H05K 1/189 (2013.01); H05K 3/0023 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0187 (2013.01); H05K 2203/0143 (2013.01); H05K 2203/0796 (2013.01); H05K 2203/095 (2013.01); H05K 2203/1163 (2013.01); H05K 2203/1194 (2013.01); H05K 2203/1476 (2013.01); H05K 2203/1545 (2013.01);
Abstract
A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.