The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Apr. 19, 2019
Canon Kabushiki Kaisha, Tokyo, JP;
Koichi Shimizu, Fujisawa, JP;
Tadashi Kosaka, Oita, JP;
Shuichi Chiba, Kawasaki, JP;
Kazuya Notsu, Yokohama, JP;
Hisatane Komori, Ayase, JP;
Satoru Hamasaki, Fujisawa, JP;
Yu Katase, Kawasaki, JP;
CANON KABUSHIKI KAISHA, Tokyo, JP;
Abstract
According to the disclosure, a relationship of Tgp>Tgf, αf1<αPCB1, and (Tgp−To)×αPCB1<(Tgf−To)×αf1+(Tgp−Tgf)×αf2 or a relationship of Tgp<Tgf, αPCB1<αf1, and (Tgf−To)×αf1<(Tgp−To)×αPCB1+(Tgf−Tgp)×αPCB2 is satisfied, where linear expansion coefficients in an in-plane direction of the substrate at a temperature below a glass transition temperature Tgp of the substrate and at a temperature above the glass transition temperature Tgp of the substrate are denoted as αPCB1 and αPCB2, respectively, linear expansion coefficient of the frame at a temperature below a glass transition temperature Tgf of the frame and at a temperature above the glass transition temperature Tgf of the frame are denoted as αf1 and αf2, respectively, and a room temperature is denoted as To.