The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Oct. 19, 2017
Applicant:

Invisage Technologies, Inc., Newark, CA (US);

Inventors:

Jae Park, Newark, CA (US);

Carey Tanner, San Francisco, CA (US);

Emanuele Mandelli, Mountain View, CA (US);

Assignee:

INVISAGE TECHNOLOGIES, INC., Newark, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/361 (2011.01); H04N 5/33 (2006.01); H01L 27/146 (2006.01); H04N 5/345 (2011.01); H04N 5/359 (2011.01); H04N 5/369 (2011.01); H04N 5/374 (2011.01); H04N 9/04 (2006.01);
U.S. Cl.
CPC ...
H04N 5/332 (2013.01); H01L 27/14605 (2013.01); H01L 27/14612 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/14645 (2013.01); H01L 27/14649 (2013.01); H01L 27/14665 (2013.01); H01L 27/14685 (2013.01); H01L 27/14689 (2013.01); H04N 5/345 (2013.01); H04N 5/359 (2013.01); H04N 5/3594 (2013.01); H04N 5/361 (2013.01); H04N 5/3696 (2013.01); H04N 5/374 (2013.01); H04N 9/045 (2013.01);
Abstract

Imaging apparatus () includes a semiconductor substrate () and an array () of pixel circuits (), which are arranged in a matrix on the semiconductor substrate and define respective pixels () of the apparatus. Pixel electrodes () are respectively coupled to the pixel circuits, and a photosensitive () is formed over the pixel electrodes. A common electrode (), which is at least partially transparent, is formed over the photosensitive film. An opaque metallization layer () is formed over the photosensitive film on one or more of the pixels and coupled in ohmic contact to the common electrode. Control circuitry () is coupled to apply a bias to the common electrode via the opaque metallization layer while correcting a black level of the output values from the pixels using the signals received from the one or more of the pixels over which the opaque metallization layer is formed.


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