IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10735101 B1

PDFFull Text
Date of Patent:
Aug. 04, 2020

Filed:

Jul. 31, 2017

Method for manufacturing an optical communication device

Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Stefan Pfnuer, San Jose, CA (US);

Ravi Kachru, San Jose, CA (US);

John Fangman, Leesport, PA (US);

Utpal Chakrabarti, Allentown, PA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:

Meunier Carlin & Curfman LLC

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H04B 10/50 (2013.01); G02B 6/42 (2006.01); H01L 33/64 (2010.01); H01L 33/52 (2010.01); H05K 13/00 (2006.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01S 5/02 (2006.01); H01S 5/026 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H04B 10/503 (2013.01); G02B 6/4208 (2013.01); G02B 6/4236 (2013.01); G02B 6/4249 (2013.01); G02B 6/4251 (2013.01); G02B 6/4271 (2013.01); H01L 33/52 (2013.01); H01L 33/64 (2013.01); H05K 13/00 (2013.01); H01L 25/167 (2013.01); H01S 5/02 (2013.01); H01S 5/0265 (2013.01); H01S 5/02236 (2013.01); H01S 5/02288 (2013.01); H01S 5/02415 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49778 (2015.01); Y10T 29/49815 (2015.01); Y10T 29/49826 (2015.01); Y10T 29/53174 (2015.01); Y10T 29/53178 (2015.01);
Abstract

A method of manufacturing an optical communication device includes preparing first and second pre-defined break lines in a carrier wafer. A first sub-mount is positioned near the first break line to accommodate an optical laser and a second sub-mount is positioned near the second break line to accommodate an optical modulator. The first sub-mount is secured to a thermally conductive and electrically nonconductive spacer which is secured to a thermo-electrical cooler that defines a gap between the first submount and the thermo-electrical cooler. A portion of the carrier wafer between the sub-mounts is removed.

Find Patent Forward Citations

Loading…