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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10734869 B1

PDFFull Text
Date of Patent:
Aug. 04, 2020

Filed:

Apr. 27, 2015

Control device with semiconductor module having bent latch, control, power supply and motor control terminals

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takahisa Kawaguchi, Tokyo, JP;

Kazuhisa Takashima, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorneys:

Sughrue Mion, PLLC

Richard C. Turner

Primary Examiner:

Maged M Almawri

Int. Cl.
CPC ...
H02K 11/33 (2016.01); H02K 29/00 (2006.01); H01L 25/18 (2006.01); H02K 11/00 (2016.01); H02M 7/48 (2007.01); H01L 25/07 (2006.01); B62D 5/04 (2006.01); H01L 25/065 (2006.01); H02K 5/22 (2006.01); H02M 7/537 (2006.01); H02P 27/06 (2006.01);
U.S. Cl.
CPC ...
H02K 11/33 (2016.01); B62D 5/0406 (2013.01); H01L 25/065 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H02K 5/225 (2013.01); H02K 11/00 (2013.01); H02K 29/00 (2013.01); H02M 7/48 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/40 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73221 (2013.01); H01L 2924/00014 (2013.01); H02M 7/537 (2013.01); H02P 27/06 (2013.01);
Abstract

The present invention is concerning the control device equipped with a motorand a control unitwhich is coaxial to the motor. An upper frameis arranged at a boundary between the motorand the control unit. A semiconductor module, an intermediate member, and a control boardare provided in the control unit. For assembly of the semiconductor moduleand the intermediate member, a latch portionis provided on one of the semiconductor moduleand the intermediate member, and an engaged portion into which the latch portionlocks is provided on the other of the semiconductor moduleand the intermediate member, whereby positioning of the semiconductor moduleand the intermediate memberis achieved.

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