The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Mar. 02, 2018
Applicant:
Cisco Technology, Inc., San Jose, CA (US);
Inventors:
Dominic F. Siriani, Allentown, PA (US);
Sean P. Anderson, Macungie, PA (US);
Vipulkumar Patel, Breinigsville, PA (US);
Assignee:
Cisco Technology, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/343 (2006.01); H01S 5/02 (2006.01); H01L 21/68 (2006.01); H01S 5/34 (2006.01); H01L 21/02 (2006.01); H01S 5/022 (2006.01); B82Y 20/00 (2011.01); H01S 5/042 (2006.01); H01S 5/125 (2006.01); H01S 5/22 (2006.01); H01S 5/10 (2006.01);
U.S. Cl.
CPC ...
H01S 5/343 (2013.01); H01L 21/02002 (2013.01); H01L 21/68 (2013.01); H01S 5/021 (2013.01); H01S 5/0203 (2013.01); H01S 5/0215 (2013.01); H01S 5/02276 (2013.01); H01S 5/3412 (2013.01); B82Y 20/00 (2013.01); H01S 5/02268 (2013.01); H01S 5/04257 (2019.08); H01S 5/1032 (2013.01); H01S 5/125 (2013.01); H01S 5/22 (2013.01); H01S 2301/176 (2013.01);
Abstract
A wafer comprising: a silicon substrate; a base layer of a predetermined thickness of a III-V semiconductor material bonded with the silicon substrate; and at least one layer grown on the base layer to form a plurality of quantum dot lasers.