The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Feb. 04, 2019
Applicant:

Toppan Printing Co., Ltd., Tokyo, JP;

Inventors:

Tomohiko Yamazaki, Tokyo, JP;

Masayoshi Suzuta, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 2/02 (2006.01); H01G 11/78 (2013.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
H01M 2/0287 (2013.01); B32B 15/20 (2013.01); H01G 11/78 (2013.01); H01M 2/0202 (2013.01); H01M 2/026 (2013.01); H01M 2/0277 (2013.01); H01M 2/0285 (2013.01); H01M 2/0295 (2013.01); H01M 2002/0297 (2013.01); Y02E 60/13 (2013.01);
Abstract

The present invention relates to a power storage device packaging material. The packaging material includes at least a substrate protective layer, a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer in this order. The substrate protective layer is a cured product of a raw material containing a polyester resin and a polyisocyanate compound, has a glass transition temperature (Tg) of 60 to 140° C., and has a thickness of 1 to 5 μm, with a ratio of the thickness of the substrate protective layer to the thickness of the substrate layer being 35% or less.


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