The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Feb. 09, 2015
Applicant:

Merck Patent Gmbh, Darmstadt, DE;

Inventors:

Amir Hossain Parham, Frankfurt am Main, DE;

Philipp Stoessel, Frankfurt am Main, DE;

Christof Pflumm, Darmstadt, DE;

Anja Jatsch, Frankfurt am Main, DE;

Joachim Kaiser, Darmstadt, DE;

Anna Hayer, Mainz, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); C09K 11/06 (2006.01); H01L 51/50 (2006.01); H01J 9/22 (2006.01); C07D 209/82 (2006.01); C07D 413/10 (2006.01); C07D 403/14 (2006.01); C07D 403/10 (2006.01); C07D 413/14 (2006.01); C07D 221/20 (2006.01); C07D 251/24 (2006.01); C07D 403/04 (2006.01); C09D 5/22 (2006.01); C09D 5/24 (2006.01); C09K 11/02 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0067 (2013.01); C07D 209/82 (2013.01); C07D 221/20 (2013.01); C07D 251/24 (2013.01); C07D 403/04 (2013.01); C07D 403/10 (2013.01); C07D 403/14 (2013.01); C07D 413/10 (2013.01); C07D 413/14 (2013.01); C09D 5/22 (2013.01); C09D 5/24 (2013.01); C09K 11/025 (2013.01); C09K 11/06 (2013.01); H01J 9/223 (2013.01); H01L 51/0039 (2013.01); H01L 51/0043 (2013.01); H01L 51/0052 (2013.01); H01L 51/0072 (2013.01); H01L 51/5004 (2013.01); H01L 51/5012 (2013.01); C09K 2211/1007 (2013.01); C09K 2211/1011 (2013.01); C09K 2211/1014 (2013.01); C09K 2211/1029 (2013.01); C09K 2211/1033 (2013.01); C09K 2211/1044 (2013.01); C09K 2211/1048 (2013.01); C09K 2211/1059 (2013.01); C09K 2211/1092 (2013.01); C09K 2211/185 (2013.01); H01L 51/001 (2013.01); H01L 51/0007 (2013.01); H01L 51/0085 (2013.01); H01L 51/5016 (2013.01); H01L 51/5056 (2013.01); H01L 51/5072 (2013.01); H01L 51/56 (2013.01); H01L 2251/5384 (2013.01); H01L 2251/55 (2013.01); H01L 2251/552 (2013.01); H01L 2251/556 (2013.01);
Abstract

The present invention relates to a formulation comprising organic materials for the production of organic electronic devices having a low failure rate.


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