The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Jul. 09, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Hauk Han, Hwaseong-si, KR;

Je-hyeon Park, Suwon-si, KR;

Do-hyung Kim, Seongnam-si, KR;

Tae-yong Kim, Daegu, KR;

Keun Lee, Cheongju-si, KR;

Jeong-gil Lee, Hwaseong-si, KR;

Hyun-seok Lim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/49 (2006.01); H01L 27/11582 (2017.01); H01L 27/1157 (2017.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42372 (2013.01); H01L 27/1157 (2013.01); H01L 27/11582 (2013.01); H01L 29/4966 (2013.01); H01L 29/517 (2013.01); H01L 29/6653 (2013.01); H01L 29/66795 (2013.01); H01L 29/7827 (2013.01); H01L 29/7833 (2013.01); H01L 29/66545 (2013.01); H01L 29/78642 (2013.01);
Abstract

A semiconductor memory device may include a substrate, gate electrode structures stacked on the substrate, insulation patterns between the gate electrode structures, vertical channels penetrating through the gate electrode structures and the insulation patterns, and a data storage pattern. The vertical channels may be electrically connected to the substrate. The data storage pattern may be arranged between the gate electrode structures and the vertical channels. Each of the gate electrode structures may include a barrier film, a metal gate, and a crystal grain boundary plugging layer. The crystal grain boundary plugging layer may be between the barrier film and the metal gate.


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