The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Dec. 28, 2017
Applicant:

Aledia, Grenoble, FR;

Inventors:

Zheng-Sung Chio, Melaka, MY;

Wei Sin Tan, Meylan, FR;

Vincent Beix, Fontaine, FR;

Philippe Gilet, Teche, FR;

Pierre Tchoulfian, Grenoble, FR;

Assignee:

Aledia, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/24 (2010.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 33/24 (2013.01); H01L 33/46 (2013.01); H01L 33/508 (2013.01); H01L 2933/0033 (2013.01);
Abstract

A method of manufacturing an optoelectronic device, comprising the successive steps of: a) providing a substrate at least partially made of a semiconductor material and having first and second opposite faces; b) forming light-emitting diodes on the substrate, each light-emitting diode comprising a semiconductor microwire or nanowire covered by a shell; c) forming an encapsulation layer surrounding the light-emitting diodes; d) forming conductive pads on the encapsulation layer, on the side of the encapsulation layer opposite to the substrate, in contact with the light-emitting diodes; and e) forming through openings in the substrate from the side of the second face, said openings being opposite at least part of the light-emitting diodes and delimiting walls in the substrate.


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