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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10734355 B1

PDFFull Text
Date of Patent:
Aug. 04, 2020

Filed:

Dec. 22, 2017

Electronic circuit board, laminated board, and method of manufacturing electronic circuit board

Applicant:

Olympus Corporation, Tokyo, JP;

Inventor:

Takuro Suyama, Ina, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:

Scully, Scott, Murphy & Presser, P.C.

Primary Examiner:

Shaun M Campbell

Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/12 (2006.01); A61B 1/05 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 21/3065 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); A61B 1/051 (2013.01); H01L 21/3065 (2013.01); H01L 21/4803 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 23/12 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/481 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01);
Abstract

An electronic circuit board includes: electronic components; a silicon board that is plate shaped, includes a wiring pattern provided on at least one of a surface and a reverse surface thereof, and includes recessed portions where the electronic components are individually mounted; and a supporting board that is layered over the reverse surface of the silicon board, and includes a wiring pattern provided on at least one of a surface and a reverse surface thereof. Side faces of the recessed portions are perpendicular to the surface of the silicon board, the wiring pattern is connected to at least one of the electronic components mounted in the recessed portions, via at least one of a via and a bottom surface electrode provided in of the at least one of the recessed portions, and the recessed portions penetrate through the silicon board.

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