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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10734350 B1

PDFFull Text
Date of Patent:
Aug. 04, 2020

Filed:

Apr. 10, 2017

Method for manufacturing semiconductor device

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Kazutaka Honda, Tokyo, JP;

Koichi Chabana, Tokyo, JP;

Makoto Satou, Tokyo, JP;

Akira Nagai, Tokyo, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, LLP

Primary Examiner:

Seahvosh Nikmanesh

Int. Cl.
CPC ...
H01L 23/00 (2006.01); C09J 163/00 (2006.01); C09J 201/00 (2006.01); C09J 11/06 (2006.01); H01L 21/56 (2006.01); C09J 7/30 (2018.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); C09J 7/30 (2018.01); C09J 11/06 (2013.01); C09J 163/00 (2013.01); C09J 201/00 (2013.01); H01L 21/56 (2013.01); H01L 24/73 (2013.01); H01L 23/3121 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81 (2013.01); H01L 2224/81203 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/3511 (2013.01);
Abstract

There is disclosed a method for manufacturing a semiconductor device comprising a semiconductor chip having a connection portion and a wiring circuit board having a connection portion, the respective connection portions being electrically connected to each other, or a semiconductor device comprising a plurality of semiconductor chips having connection portions, the respective connection portions being electrically connected to each other. The connection portions consist of metal. The above described method comprises: (a) a first step of press-bonding the semiconductor chip and the wiring circuit board or the semiconductor chips to each other so that the respective connection portions are in contact with each other with a semiconductor adhesive interposed therebetween, at a temperature lower than a melting point of the metal of the connection portion, to obtain a temporarily connected body; (b) a second step of sealing at least a part of the temporarily connected body with a sealing resin to obtain a sealed temporarily connected body; and (c) a third step of heating the sealed temporarily connected body at a temperature equal to or higher than the melting point of the metal of the connection portion, to obtain a sealed connected body.

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