The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Nov. 07, 2019
Applicant:
Longitude Licensing Limited, Dublin, IE;
Inventor:
Akihiko Hatasawa, Tokyo, JP;
Assignee:
Longitude Licensing Limited, Dublin, IE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/532 (2006.01); H01L 21/56 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5385 (2013.01); H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 23/3135 (2013.01); H01L 23/481 (2013.01); H01L 23/53228 (2013.01); H01L 24/17 (2013.01); H01L 24/73 (2013.01); H01L 24/97 (2013.01); H01L 25/065 (2013.01); H01L 25/0657 (2013.01); H01L 25/07 (2013.01); H01L 25/50 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 24/11 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 25/18 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06544 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01);
Abstract
One semiconductor chip includes a substrate having insulation properties, a plurality of bump electrodes provided on one surface of the substrate, a plurality of recesses provided in the other surface of the substrate, and a solder layer disposed within the recesses. The recesses are formed such that the area of the opening decreases from the other surface side toward the one surface side of the substrate.