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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10734305 B1

PDFFull Text
Date of Patent:
Aug. 04, 2020

Filed:

Jan. 13, 2017

Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device

Applicant:

Dexerials Corporation, Shinagawa-ku, Tokyo, JP;

Inventors:

Hiroki Kanaya, Tokyo, JP;

Shinichi Uchida, Tokyo, JP;

Shunsuke Uchida, Tokyo, JP;

Gupta Rishabh, Tokyo, JP;

Keisuke Aramaki, Tokyo, JP;

Assignee:

DEXERIALS CORPORATION, Shinagawa-Ku, Tokyo, JP;

Attorney:

Carmody Torrance Sandak & Hennessey LLP

Primary Examiner:

Caridad Everhart

Assistant Examiner:

Ankush K Singal

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01); B29C 48/08 (2019.01); C08K 7/06 (2006.01); C08K 3/00 (2018.01); B29C 48/00 (2019.01); C08K 9/00 (2006.01); B29C 48/07 (2019.01); C09D 183/04 (2006.01); C08K 9/08 (2006.01); C08L 83/04 (2006.01); C08K 3/28 (2006.01); C08K 9/04 (2006.01); C08K 3/22 (2006.01); B29C 39/00 (2006.01); C08L 101/00 (2006.01); H01L 23/42 (2006.01); D04H 1/4242 (2012.01); H01L 23/367 (2006.01); B29L 31/18 (2006.01); B29K 105/16 (2006.01); B29K 509/02 (2006.01); B29K 101/10 (2006.01); B29K 83/00 (2006.01); C08G 77/12 (2006.01); B29K 105/24 (2006.01); C08G 77/20 (2006.01); B29K 509/04 (2006.01); B29K 86/00 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); B29C 39/00 (2013.01); B29C 48/0022 (2019.02); B29C 48/022 (2019.02); B29C 48/07 (2019.02); B29C 48/08 (2019.02); C08K 3/00 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 7/06 (2013.01); C08K 9/00 (2013.01); C08K 9/04 (2013.01); C08K 9/08 (2013.01); C08L 83/04 (2013.01); C08L 101/00 (2013.01); C09D 183/04 (2013.01); D04H 1/4242 (2013.01); H01L 23/3672 (2013.01); H01L 23/373 (2013.01); H01L 23/42 (2013.01); B29C 39/003 (2013.01); B29K 2083/00 (2013.01); B29K 2086/00 (2013.01); B29K 2101/10 (2013.01); B29K 2105/16 (2013.01); B29K 2105/243 (2013.01); B29K 2509/02 (2013.01); B29K 2509/04 (2013.01); B29K 2995/0007 (2013.01); B29K 2995/0013 (2013.01); B29L 2031/18 (2013.01); B81B 3/0081 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 2003/282 (2013.01); H01L 23/367 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/16152 (2013.01);
Abstract

A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.

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