The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Nov. 02, 2018
Applicant:
Qromis, Inc., Santa Clara, CA (US);
Inventors:
Vladimir Odnoblyudov, Danville, CA (US);
Cem Basceri, Los Gatos, CA (US);
Shari Farrens, Boise, ID (US);
Ozgur Aktas, Pleasanton, CA (US);
Assignee:
Qromis, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 21/02 (2006.01); H01L 23/66 (2006.01); H01L 29/20 (2006.01); H01L 29/78 (2006.01); H01L 25/16 (2006.01); H01L 33/32 (2010.01); H01L 33/64 (2010.01); H01P 1/30 (2006.01); H01P 3/00 (2006.01); H03H 9/02 (2006.01); B81B 3/00 (2006.01); H03H 9/17 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); B81B 3/0081 (2013.01); H01L 21/0242 (2013.01); H01L 21/0245 (2013.01); H01L 21/0254 (2013.01); H01L 21/02428 (2013.01); H01L 21/02488 (2013.01); H01L 21/02491 (2013.01); H01L 21/02505 (2013.01); H01L 21/02532 (2013.01); H01L 23/66 (2013.01); H01L 25/167 (2013.01); H01L 29/2003 (2013.01); H01L 29/7827 (2013.01); H01L 33/32 (2013.01); H01L 33/647 (2013.01); H01P 1/30 (2013.01); H01P 3/003 (2013.01); H03H 9/02102 (2013.01); B81B 2203/0127 (2013.01); H01L 21/02494 (2013.01); H01L 29/785 (2013.01); H01L 2223/6683 (2013.01); H03H 9/02047 (2013.01); H03H 9/174 (2013.01);
Abstract
An electronic device includes a support structure comprising a polycrystalline ceramic core, a first adhesion layer coupled to the polycrystalline ceramic core, a conductive layer coupled to the first adhesion layer, a second adhesion layer coupled to the conductive layer, and a barrier layer coupled to the second adhesion layer. The electronic device also includes a buffer layer coupled to the support structure, a contact layer coupled to the buffer layer, and a field-effect transistor (FET) coupled to the contact layer.