The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Sep. 04, 2018
Applicant:
Microchip Technology Incorporated, Chandler, AZ (US);
Inventors:
Assignee:
Microchip Technology Incorporated, Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/16 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H03K 4/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/16 (2013.01); H01L 21/4871 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H03K 4/00 (2013.01);
Abstract
Methods of making a semiconductor device packages may involve placing a metal material at least partially around a region of integrated circuitry embedded within an active surface of a semiconductor die, the metal material located on the active surface. At least a portion of the metal material may be left electrically disconnected from the region of integrated circuitry. The semiconductor die and the metal material may be encapsulated in an encapsulant material, the encapsulant material extending to a height above the active surface higher than a maximum height of the metal material above the active surface.