The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Jun. 01, 2018
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Beom Joon Cho, Suwon-si, KR;

Ki Young Kim, Suwon-si, KR;

Jae Young Na, Suwon-si, KR;

Jin Mo Ahn, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/232 (2006.01); H01G 4/005 (2006.01); H05K 3/34 (2006.01); H01G 4/12 (2006.01); H01G 4/38 (2006.01); H01G 2/06 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 2/06 (2013.01); H01G 4/005 (2013.01); H01G 4/1227 (2013.01); H01G 4/232 (2013.01); H01G 4/38 (2013.01); H05K 3/3426 (2013.01); H05K 3/3442 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10946 (2013.01);
Abstract

A multilayer electronic component includes first and second frame terminals, and first and second electronic components. The first frame terminal includes a first side frame and a first bottom frame extended from a lower end of the first side frame. The second frame terminal includes a second side frame facing the first side frame and a second bottom frame extended from a lower end of the second side frame. The first electronic component is disposed between the first and second side frames, and the second electronic component is stacked on the first electronic component and disposed between the first and second side frames. Conductive adhesives are provided between the first and second side frames and the first and second electronic components, but a conductive adhesive is not formed between the first and second side frames and portions of the first electronic component close to a mounting surface.


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