The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Aug. 23, 2017
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventor:
Assignee:

Facebook Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); G09G 3/32 (2016.01); H05K 3/40 (2006.01); H01L 23/498 (2006.01); G09G 3/3233 (2016.01);
U.S. Cl.
CPC ...
G09G 3/32 (2013.01); G09G 3/3233 (2013.01); H01L 23/49827 (2013.01); H05K 3/40 (2013.01); G09G 2300/0866 (2013.01);
Abstract

A multi-layer device including device layers connected by an interposer. For example, an electronic display may include a light emitting diode (LED) layer including LEDs and a control circuitry layer to provide control signals to the LEDs. The electronic display further includes an interposer positioned between the LED layer and the control circuitry layer. The interposer includes a substrate and an array of conductive pillars extending through the substrate. The conductive pillars electrically connect the LED layer with the control circuitry layer. Bonding layers may be formed on the interposer and a corresponding side of a device layer to facilitate a hybrid bonding process that electrically connects contacts of the device layer to the conductive pillars and joins the bonding layers to attach the device layer to the interposer.


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