The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

May. 02, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Suk-koo Hong, Suwon-si, KR;

Jeong-ho Mun, Yongin-si, KR;

Jin-joo Kim, Seoul, KR;

Gum-hye Jeon, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 7/09 (2006.01); G03F 7/38 (2006.01); H01L 21/027 (2006.01); G03F 7/039 (2006.01); G03F 7/022 (2006.01); H01L 21/266 (2006.01); G03F 7/095 (2006.01); G03F 7/32 (2006.01);
U.S. Cl.
CPC ...
G03F 7/2002 (2013.01); G03F 7/022 (2013.01); G03F 7/039 (2013.01); G03F 7/091 (2013.01); G03F 7/095 (2013.01); G03F 7/38 (2013.01); H01L 21/0276 (2013.01); H01L 21/266 (2013.01); G03F 7/32 (2013.01);
Abstract

Provided is a method of fabricating an integrated circuit device, the method including: forming, on a substrate, a developable bottom anti-reflective coating (DBARC) layer including a chemically amplified polymer; forming, on the DBARC layer, a photoresist layer including a non-chemically amplified resin and a photoacid generator (PAG); generating an acid from the PAG in a first region selected from the photoresist layer, by exposing the first region; diffusing the acid in the exposed first region into a first DBARC region of the DBARC layer, the first DBARC region facing the first region; and removing the first region and the first DBARC region by developing the photoresist layer and the DBARC layer.


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