The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Nov. 26, 2018
Applicant:
Fujitsu Component Limited, Tokyo, JP;
Inventors:
Shigemi Kurashima, Tokyo, JP;
Mitsuki Kanda, Tokyo, JP;
Takatoshi Yagisawa, Tokyo, JP;
Masahiro Yanagi, Tokyo, JP;
Assignee:
FUJITSU COMPONENT LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 9/00 (2006.01); H01Q 17/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4292 (2013.01); H05K 9/0058 (2013.01); H05K 9/0084 (2013.01); H01Q 17/002 (2013.01); H01Q 17/008 (2013.01);
Abstract
A high-frequency module includes a first board on which an electronic device is mounted, a second board on which at least wiring is formed, and a radio-wave absorber disposed between the first board and the second board. Multiple slits are formed in the radio-wave absorber.