The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Jul. 26, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Ki Jae Song, Asan-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 31/26 (2020.01);
U.S. Cl.
CPC ...
G01R 31/2875 (2013.01); G01R 31/2879 (2013.01); G01R 31/2642 (2013.01);
Abstract

An apparatus for testing semiconductor devices and a system including the same includes a socket unit having a plurality of sockets into which a plurality of semiconductor devices are inserted, respectively. Also included is a module unit including a first sub-module for receiving a test signal from a host and providing the same test signal to each of the plurality of sockets, and a second sub-module including the same structure as the first sub-module. The first sub-module includes a first buffer unit including an amplifier having an input terminal to which an input signal is inputted and an output terminal to amplify and output the input signal inputted based on a reference voltage (VT), and a reference resistor having one end connected to the input terminal of the amplifier and the other end to which the reference voltage is applied, and a second buffer unit including the same structure as the first buffer unit.


Find Patent Forward Citations

Song, Ki. (2020). Apparatus and method for testing semiconductor device and system comprising the same (U.S. Patent No. 10732219). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10732219

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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