The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Aug. 03, 2016
Applicant:
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Inventors:
Takeshi Konno, Hitachinaka, JP;
Hiroshi Kikuchi, Hitachinaka, JP;
Kentarou Miyajima, Hitachinaka, JP;
Munenori Degawa, Hitachinaka, JP;
Assignee:
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 19/00 (2006.01); G01L 19/04 (2006.01); H01L 21/58 (2006.01); H01L 23/00 (2006.01); G01L 9/00 (2006.01); G01L 19/14 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0042 (2013.01); G01L 19/147 (2013.01); H01L 23/00 (2013.01);
Abstract
To provide a high-performance semiconductor sensor device and a method for manufacturing the semiconductor sensor device. This semiconductor sensor device has a sensor chip, and a first thin film formed on the sensor chip, said sensor chip being mechanically connected, via the first thin film, to a second thin film formed on a base formed of a polycrystalline material.