The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Jan. 04, 2018
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Yoo Min Park, Seoul, KR;

Myeongha Yi, Seoul, KR;

Jinho Son, Seoul, KR;

Assignee:

LG Electronics Inc., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25D 17/06 (2006.01); F25B 21/02 (2006.01); F25D 23/08 (2006.01); F25D 11/02 (2006.01); F25D 25/02 (2006.01); F25D 23/06 (2006.01); F25B 5/02 (2006.01);
U.S. Cl.
CPC ...
F25D 17/065 (2013.01); F25B 21/02 (2013.01); F25D 11/02 (2013.01); F25D 11/025 (2013.01); F25D 23/062 (2013.01); F25D 23/069 (2013.01); F25D 23/087 (2013.01); F25D 25/025 (2013.01); F25B 5/02 (2013.01); F25B 2321/023 (2013.01); F25B 2321/0251 (2013.01); F25B 2341/062 (2013.01); F25D 2317/061 (2013.01); F25D 2323/021 (2013.01); Y02B 40/34 (2013.01);
Abstract

A refrigerator that includes: a storage space configured to be cooled by a refrigeration cycle cooling system; a wall defines a boundary of the storage space; a low temperature case that is arranged adjacent to a portion of a first surface of the wall; a thermoelectric element module (TEM) assembly that is configured to supply cool air to the low temperature case; and a TEM accommodating part that protrudes from the first surface of the wall and that accommodates the TEM assembly, wherein the low temperature case includes an opening through which the TEM accommodating part is inserted, and wherein a sealant is provided between the low temperature case and the wall to couple the low temperature case to the first surface of the wall is disclosed.


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