The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Mar. 23, 2017
Applicant:
Osram Oled Gmbh, Regensburg, DE;
Inventors:
Thomas Schlereth, Regensburg, DE;
Elena Rachkova, Pielenhofen, DE;
Michael Bestele, Lappersdorf, DE;
Ivar Tangring, Regensburg, DE;
Assignee:
OSRAM Opto Semiconductors GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/232 (2016.01); H01L 25/075 (2006.01); F21K 9/275 (2016.01); H01L 33/54 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); F21Y 115/10 (2016.01); F21Y 103/10 (2016.01);
U.S. Cl.
CPC ...
F21K 9/232 (2016.08); F21K 9/275 (2016.08); H01L 25/0753 (2013.01); H01L 33/50 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); H01L 33/505 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0091 (2013.01);
Abstract
A filament includes a multiplicity of light-emitting semiconductor chips, wherein the semiconductor chips are arranged on a carrier, the semiconductor chips being electrically contacted, a scattering structure is configured to scatter light of the light-emitting semiconductor chips, the scattering structure is formed by structuring a surface, a converter covers the light-emitting semiconductor chips, and the structuring of the surface is formed on a surface of the converter.